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Polymer Structure

Properties and Overview of PI (Polyimide)

Overview:

Image of PI or Application PI (Polyimide) is a high-performance polymer known for its exceptional thermal stability, mechanical strength, and chemical resistance. Renowned for its ability to perform in extreme environments, PI is a critical material in the aerospace, electronics, automotive, and medical industries. Its unique properties, including excellent electrical insulation and resistance to high temperatures, make it indispensable for demanding engineering applications.


Production:

The production of polyimide typically involves the polymerization of aromatic dianhydrides and diamines, creating a highly crosslinked molecular structure. This structure imparts superior thermal and chemical properties, enabling PI to withstand temperatures exceeding 400°C without significant degradation. The polymer can be processed into films, fibers, foams, and molded parts, offering versatility in fabrication. Advanced processing methods like vapor deposition and spin coating are used to create ultra-thin films for specialized applications, while molding techniques are employed for structural components.


Applications:

PI is widely utilized across industries for its unmatched performance in extreme conditions. In electronics, it is a key material for flexible printed circuit boards, wire insulation, and chip packaging, where its dielectric properties and thermal stability ensure reliability and longevity. In aerospace, PI is used for insulation, structural components, and adhesives, as it can endure high temperatures and stresses in flight. The automotive industry employs PI for engine components, gaskets, and sensor housings, benefiting from its resistance to heat, wear, and corrosive environments. PI is used for catheters, surgical instruments, and flexible sensors in medical applications, where its biocompatibility and durability are critical. Additionally, PI is used in advanced manufacturing technologies such as 3D printing, where its high-performance characteristics support the creation of precise, functional prototypes and components.


Summary:

Polyimide is a remarkable polymer that combines thermal stability, mechanical strength, and chemical resistance, making it essential for applications in challenging environments. Its versatility and ability to perform under extreme conditions ensure its continued importance across various industries. As innovation advances and the demand for high-performance materials grows, PI remains a cornerstone of engineering and manufacturing, driving progress in aerospace, electronics, healthcare, and beyond.



See a comprehensive list of electrical, mechanical, physical and thermal properties for PI (Polyimide) below:



Electrical Properties of PI (Polyimide)

Electrical Property (Units) Value
PI (Polyimide) Dielectric Constant at 'Standard Temperature and Pressure' 3.5 to 4.0
PI (Polyimide) Electrical Breakdown Voltage at Atmospheric Pressure (kV/mm) ~150 to 300
PI (Polyimide) Electrical Conductivity (S/m) 1.00E-17 to 1.00E-15
PI (Polyimide) Electrical Resistivity at Room Temperature (25°C) (Ω·m) 1.00E+15 to 1.00E+17
PI (Polyimide) Magnetic Property N/A
PI (Polyimide) Superconducting Transition Temperature (K) N/A
PI (Polyimide) Temperature Coefficient of Resistance (°C⁻¹) Unknown

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Mechanical Properties of PI (Polyimide)

Mechanical Property (Units) Value
PI (Polyimide) Compressive Strength (MPa) 80 to 130
PI (Polyimide) Ductile to Brittle Transition Temperature (°C) - 100 to - 70
PI (Polyimide) Fatigue Limit (MPa) 45
PI (Polyimide) Fracture Toughness (MPa·√m) 2.8
PI (Polyimide) Hardness Brinell 85
PI (Polyimide) Hardness Rockwell 125 HRR
PI (Polyimide) Hardness Vickers 120
PI (Polyimide) Heat Deflection Temperature (°C) 250
PI (Polyimide) Modulus of Elasticity / Young's Modulus (GPa) 3
PI (Polyimide) Percent Elongation (%) 25
PI (Polyimide) Poissons Ratio 0.35
PI (Polyimide) Shear Modulus (GPa) 1.1
PI (Polyimide) Shear Strength (MPa) 65
PI (Polyimide) Ultimate Tensile Strength (MPa) 110
PI (Polyimide) Yield Strength (MPa) 90

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Physical Properties of PI (Polyimide)

Physical Property (Units) Value
PI (Polyimide) Boiling Point at Atmospheric Pressure (°C) Decomposes
PI (Polyimide) Chemical Composition (Element %) (C22H10O5N2)n
PI (Polyimide) Cost ($/kg) 100 to 200
PI (Polyimide) Density at 'Standard Temperature and Pressure' (kg/m3) 1420 to 1440
PI (Polyimide) Glass Transition Temperature at Atmospheric Pressure (°C) 360
PI (Polyimide) Melting Point at Atmospheric Pressure (°C) 500
PI (Polyimide) Polymer Family Thermosetting
PI (Polyimide) Refractive Index 1.7
PI (Polyimide) Specific Gravity 1.42 to 1.44
PI (Polyimide) Viscosity at Melting Point (mPa·s) Unknown

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Thermal Properties of PI (Polyimide)

Thermal Property (Units) Value
PI (Polyimide) Coefficient of Thermal Expansion (µm/m·K) 5 to 20
PI (Polyimide) Emissivity Coefficient 0.8 to 0.85
PI (Polyimide) Specific Heat Capacity (J/kg·K) 1100
PI (Polyimide) Thermal Conductivity (W/m.K) 0.12
PI (Polyimide) Thermal Conductivity (BTU/h·ft·°F) 0.07

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